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  3. Microelectronics Series #3: Digital Twinning

Microelectronics Series #3: Digital Twinning

@ 12:30
  • Description:

    This third of the four-webinar series will review the trends towards Digital Twins' application throughout the whole product life cycle, from pre-silicon development for verification and software development, system integration before fabrication, and product bring-up to applications all the way to the end-of-life of a product. We will introduce practical examples for the industry verticals Consumer, Hyperscale Computing, Mobile, 5G Communications, Aerospace & Defense, Automotive, Industrial and Health. We will touch on critical challenges like reusing data between different phases of development, the impact of model fidelity on use-models, and the connection of models at varying accuracy levels to find the optimal balance between performance and development efforts.


    Speakers:


    Frank Schirrmeister

    Frank Schirrmeister is a senior group director, solutions & ecosystem at Cadence, where he leads a team translating customer challenges in the hyperscale, communications, consumer, automotive,  aerospace/defense, industrial and healthcare vertical domains into specific requirements and solutions. 

    Frank holds a Dipl.-Ing. in electrical engineering from the Technical University of Berlin, Germany. Prior to joining Cadence, Frank held senior engineering and product management positions in embedded software, semiconductor and system development, both in Europe and the United States.


    Who Should Attend:

    Innovators, Change Agents, DoD Thinkers and Doers


    DAU has an FAQ page with instructions for clearing the cache in any browser, we should include this with any other "tips" when using a Teams platform:  https://www.dau.edu/faq/p/Clear-Cache 


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